JPS6339170U - - Google Patents
Info
- Publication number
- JPS6339170U JPS6339170U JP13179886U JP13179886U JPS6339170U JP S6339170 U JPS6339170 U JP S6339170U JP 13179886 U JP13179886 U JP 13179886U JP 13179886 U JP13179886 U JP 13179886U JP S6339170 U JPS6339170 U JP S6339170U
- Authority
- JP
- Japan
- Prior art keywords
- cores
- circumferential direction
- wound around
- utility
- processing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131798U JPH0650543Y2 (ja) | 1986-08-27 | 1986-08-27 | プラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986131798U JPH0650543Y2 (ja) | 1986-08-27 | 1986-08-27 | プラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6339170U true JPS6339170U (en]) | 1988-03-14 |
| JPH0650543Y2 JPH0650543Y2 (ja) | 1994-12-21 |
Family
ID=31030583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986131798U Expired - Lifetime JPH0650543Y2 (ja) | 1986-08-27 | 1986-08-27 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650543Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023173302A (ja) * | 2022-05-25 | 2023-12-07 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5372790A (en) * | 1976-12-10 | 1978-06-28 | Hitachi Ltd | Evaporating apparatus by sputtering |
| JPS57192267A (en) * | 1981-05-19 | 1982-11-26 | Toshiba Corp | Dry etching apparatus |
-
1986
- 1986-08-27 JP JP1986131798U patent/JPH0650543Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5372790A (en) * | 1976-12-10 | 1978-06-28 | Hitachi Ltd | Evaporating apparatus by sputtering |
| JPS57192267A (en) * | 1981-05-19 | 1982-11-26 | Toshiba Corp | Dry etching apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023173302A (ja) * | 2022-05-25 | 2023-12-07 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0650543Y2 (ja) | 1994-12-21 |